41. PLCC (plastic leaded chip carrier)
Plastic chip carrier with leads. One of the surface mount package. The pins are led out from the four sides of the package, in the shape of a ding, and are plastic products. It was first adopted by Texas Instruments in the United States for 64k-bit DRAM and 256kDRAM, and is now widely used in circuits such as logic LSIs and DLDs (or process logic devices). The pin center distance is 1.27mm and the number of pins ranges from 18 to 84. J-shaped pins are less deformable and easier to handle than QFPs, but cosmetic inspection after soldering is more difficult. PLCC is similar to LCC (also known as QFN). Previously, the only difference between the two was that the former was made of plastic and the latter was made of ceramic. However, there are now J-shaped packages made of ceramic and pinless packages made of plastic (marked as plastic LCC, PC LP, P-LCC, etc.), which are indistinguishable.
42. P-LCC (plastic teadless chip carrier)(plastic leadedchip currier)
Sometimes it is an alias for plastic QFJ, sometimes it is an alias for QFN (plastic LCC) (see QFJ and QFN). Some LSI manufacturers use PLCC for leaded package and P-LCC for leadless package to show the difference.
43. QFH (quad flat high package)
Quad flat package with thick pins. A type of plastic QFP in which the body of the QFP is made thicker to prevent breakage of the package body (see QFP). The name used by some semiconductor manufacturers.
44. QFI (quad flat I-leaded packgac)
Quad flat I-leaded package. One of the surface mount packages. The pins are led from the four sides of the package in an I-shaped downward direction. Also called MSP (see MSP). The mount is touch-soldered to the printed substrate. Since the pins do not protrude, the mounting footprint is smaller than that of the QFP.
45. QFJ (quad flat J-leaded package)
Quad flat J-leaded package. One of the surface mount packages. The pins are led from the four sides of the package in a J-shape downward. This is the name specified by the Japan Electrical and Mechanical Manufacturers Association. The pin center distance is 1.27mm.
There are two types of materials: plastic and ceramic. Plastic QFJs are mostly called PLCCs (see PLCC) and are used in circuits such as microcomputers, gate displays, DRAMs, ASSPs, OTPs, etc. Pin counts range from 18 to 84.
Ceramic QFJs are also known as CLCC, JLCC (see CLCC). Windowed packages are used for UV-erase EPROMs and microcomputer chip circuits with EPROMs. Pin counts range from 32 to 84.
46. QFN (quad flat non-leaded package)
Quad flat non-leaded package. One of the surface mount packages. Nowadays, it is mostly called LCC, and QFN is the name specified by the Japan Electrical and Mechanical Manufacturers Association. The package is equipped with electrode contacts on all four sides, and because it has no pins, the mounting area is smaller than QFP and the height is lower than QFP. However, when stress is generated between the printed substrate and the package, it cannot be relieved at the electrode contacts. Therefore, it is difficult to make as many electrode contacts as QFP’s pins, which generally range from 14 to 100. There are two types of materials: ceramic and plastic. The electrode contact centers are 1.27 mm apart.
Plastic QFN is a low cost package with a glass epoxy printed substrate base. In addition to 1.27mm, there are also 0.65mm and 0.5mm electrode contact center distances. This package is also called plastic LCC, PCLC, P-LCC, etc.
47. QFP (quad flat package)
Quad flat package. One of the surface mount packages, the pins are led from four sides in a seagull wing (L) shape. There are three types of substrates: ceramic, metal and plastic. In terms of quantity, plastic packages make up the majority. Plastic QFPs are the most popular multi-pin LSI package when the material is not specifically indicated. It is used not only for digital logic LSI circuits such as microprocessors and gate displays, but also for analog LSI circuits such as VTR signal processing and audio signal processing. The maximum number of pins in the 0.65mm center pitch is 304.
48. QFP (FP) (QFP fine pitch)
QFP (QFP fine pitch) is the name specified in the JEM standard. It refers to QFPs with a pin center distance of 0.55mm, 0.4mm, 0.3mm, etc. less than 0.65mm.
49. QIC (quad in-line ceramic package)
The alias of ceramic QFP. Some semiconductor manufacturers use the name (see QFP, Cerquad).
50. QIP (quad in-line plastic package)
Alias for plastic QFP. Some semiconductor manufacturers use the name (see QFP).
51. QTCP (quad tape carrier package)
One of the TCP packages, in which pins are formed on an insulating tape and lead out from all four sides of the package. It is a thin package using TAB technology.
52. QTP (quad tape carrier package)
Quad tape carrier package. The name used for the QTCP form factor established by the Japan Electrical and Mechanical Manufacturers Association in April 1993 (see TCP).
53、QUIL(quad in-line)
An alias for QUIP (see QUIP).
54. QUIP (quad in-line package)
Quad in-line package with four rows of pins. The pins are led from both sides of the package and are staggered and bent downward into four rows every other one. The pin center distance is 1.27mm, when inserted into the printed substrate, the insertion center distance becomes 2.5mm, so it can be used in standard printed circuit boards. It is a smaller package than the standard DIP. These packages are used by NEC for microcomputer chips in desktop computers and home appliances. There are two types of materials: ceramic and plastic. The number of pins is 64.
55. SDIP (shrink dual in-line package)
One of the cartridge packages, the shape is the same as DIP, but the pin center distance (1.778 mm) is smaller than DIP (2.54 mm), hence the name. The number of pins ranges from 14 to 90, and is also called SH-DIP. There are two types of materials: ceramic and plastic.
56. SH-DIP (shrink dual in-line package)
The same as SDIP, the name used by some semiconductor manufacturers.
57. SIL (single in-line)
The alias of SIP (see SIP). The name SIL is mostly used by European semiconductor manufacturers.
58. SIMM (single in-line memory module)
Single in-line memory module. A memory module with electrodes near only one side of the printed substrate. Usually refers to the component that is inserted into a socket. Standard SIMMs are available with 30 electrodes at 2.54mm center distance and 72 electrodes at 1.27mm center distance. SIMMs with 1 and 4 megabit DRAMs in SOJ packages on one or both sides of a printed substrate are widely used in personal computers, workstations, and other devices. At least 30-40% of DRAMs are assembled in SIMMs.
59. SIP (single in-line package)
Single in-line package. The pins are led from one side of the package and arranged in a straight line. When assembled on a printed substrate, the package is in a side-standing position. The pin center distance is typically 2.54mm and the number of pins ranges from 2 to 23, mostly in custom packages. The shape of the package varies. Some packages with the same shape as ZIP are also called SIP.
60. SK-DIP (skinny dual in-line package)
A type of DIP. It refers to a narrow DIP with a width of 7.62mm and a pin center distance of 2.54mm, and is commonly referred to as a DIP (see DIP).
61. SL-DIP (slim dual in-line package)
A type of DIP. It is a narrow DIP with a width of 10.16mm and a pin center distance of 2.54mm, and is commonly referred to as DIP.
62. SMD (surface mount devices)
Surface mount devices. Occasionally, some semiconductor manufacturers classify SOP as SMD (see SOP).
63. SO (small out-line)
SOP’s alias. This alias is used by many semiconductor manufacturers around the world. (See SOP).
64. SOI (small out-line I-leaded package)
I-shaped pin small out-line package. One of the surface mount packs. The pins are led downward from both sides of the package in an I-shape with a center distance of 1.27mm, and the mounting area is smaller than that of SOP. Number of pins 26.
65. SOIC (small out-line integrated circuit)
The alias of SOP (see SOP). Many foreign semiconductor manufacturers have adopted this name.
66. SOJ (Small Out-Line J-Leaded Package)
J-shaped pin small outline package. One of the surface mount package. Pins from both sides of the package lead down to J-shaped, so named. DRAM devices in SO J packages are mostly assembled on SIMMs. The pin center distance is 1.27mm and the number of pins ranges from 20 to 40 (see SIMM).
67. SQL (Small Out-Line L-leaded package)
According to the JEDEC (Joint Electronic Device Engineering Council) standard for SOP adopted name (see SOP).
68. SONF (Small Out-Line Non-Fin)
SOP without heat sink, the same as the usual SOP. The NF (non-fin) mark was intentionally added to indicate the difference in power IC packages without a heat sink. The name used by some semiconductor manufacturers (see SOP).
69. SOF (small Out-Line package)
Small Outline Package. One of surface mount package, the pins are led out from both sides of the package in the shape of seagull wings (L-shaped). There are two types of materials: plastic and ceramic. Also known as SOL and DFP.
SOP is used not only for memory LSI, but also for ASSP and other circuits that are not too large. SOP is the most popular surface mount package in the field where the input and output terminals do not exceed 10 to 40. The pin center distance is 1.27mm, and the number of pins ranges from 8 to 44.
In addition, SOPs with pin center distance less than 1.27mm are also called SSOPs; SOPs with assembly height less than 1.27mm are also called TSOPs (see SSOP, TSOP). There is also a SOP with a heat sink.
70. SOW (Small Outline Package (Wide-Jype)
Post time: May-30-2022