This paper enumerates some common professional terms and explanations for the assembly line processing of SMT machine.
21. BGA
BGA is short for “Ball Grid Array”, which refers to an integrated circuit device in which the device leads are arranged in a spherical grid shape on the bottom surface of the package.
22. QA
QA is short for “Quality assurance”, referring to Quality assurance. In pick and place machine processing is often represented by quality inspection, to ensure quality.
23. Empty welding
There is no tin between the component pin and the solder pad or there is no soldering for other reasons.
24. Reflow Oven False welding
The amount of tin between the component pin and the solder pad is too small, which is below the welding standard.
25. cold welding
After the solder paste is cured, there is a vague particle attachment on the solder pad, which is not up to the welding standard.
26. The wrong parts
Incorrect location of components due to BOM, ECN error, or other reasons.
27. Missing parts
If there is no soldered component where the component should be soldered, it is called missing.
28. Tin slag tin ball
After the welding of PCB board, there are extra tin slag tin ball on the surface.
29. ICT testing
Detect open circuit, short circuit and welding of all components of PCBA by testing probe contact test point. It has the characteristics of simple operation, fast and accurate fault location
30. FCT test
FCT test is often referred to as functional test. Through simulating the operating environment, PCBA is in various design states at work, so as to obtain the parameters of each state to verify the function of PCBA.
31. Aging test
Burn-in test is to simulate the effects of various factors on PCBA that may occur in the real use conditions of the product.
32. Vibration test
Vibration test is to test the anti-vibration ability of simulated components, spare parts and complete machine products in the use environment, transportation and installation process. The ability to determine whether a product can withstand a variety of environmental vibrations.
33. Finished assembly
After the completion of the test PCBA and the shell and other components are assembled to form the finished product.
34. IQC
IQC is the abbreviation of “Incoming Quality Control”, refers to the Incoming Quality inspection, is the warehouse to purchase material Quality Control.
35. X – Ray detection
X-ray penetration is used to detect the internal structure of electronic components, BGA and other products. It can also be used to detect the welding quality of solder joints.
36. steel mesh
The steel mesh is a special mould for SMT. Its main function is to assist in the deposition of solder paste. The purpose is to transfer the exact amount of solder paste to the exact location on the PCB board.
37. fixture
Jigs are the products that need to be used in the process of batch production. With the help of the production of jigs, production problems can be greatly reduced. Jigs are generally divided into three categories: process assembly jigs, project test jigs and circuit board test jigs.
38. IPQC
Quality control in PCBA manufacturing process.
39. OQA
Quality inspection of finished products when they leave the factory.
40. DFM manufacturability check
Optimize product design and manufacturing principles, process and accuracy of components. Avoid manufacturing risks.
Post time: Jul-09-2021