SMT rework stations can be divided into 4 types according to their construction, application and complexity: simple type, complex type, infrared type and infrared hot air type.
1. Simple type: this kind of rework equipment is more common than independent soldering iron tool function, can choose to use different specifications of the iron head according to component specifications, part of the system and fixed PCB operating platform, mainly for through-hole component heating, chip soldering and chip removal, etc.
2. Complex type: complex type reworking equipment and simple type reworking equipment, compared with both can disassemble components, spot coating solder paste, mounting components and welding components, the most critical is more image positioning system, temperature control system, controlled vacuum suction and release system, etc. This kind of equipment mainly has GOOT reworking device, BGA reworking station, etc.
3. Infrared type: infrared type rework equipment is mainly the use of infrared radiation heating effect to complete the rework of components, infrared radiation heating effect has uniformity, no local cooling phenomenon occurs when the hot air reflow heating, the early warming slow, the late warming fast, penetrating relatively strong, but the rework several times the PCB board is easy to cause delamination through the hole does not work.
4. Infrared hot air type: infrared hot air type rework equipment through the combination of infrared and thermal sub heating for rework, concentrating the advantages of infrared and hot air rework equipment. If you use full infrared continuous heating, easy to lead to temperature instability, infrared heating surface will be relatively large, then some of the potting board if not protected, do BGA will lead to the surrounding chip burst tin, such as laptop repair is generally not full infrared heating, but the use of infrared hot air combination heating.
Features of NeoDen BGA rework station
Power Supply: AC220V±10%, 50/60HZ
Power: 5.65KW(Max)，Top heater(1.45KW)
Bottom heater (1.2KW)，IR Preheater (2.7KW),Other(0.3KW)
PCB Size: 412*370mm(Max);6*6mm(Min)
BGA Chip Size: 60*60mm(Max);2*2mm(Min)
IR Heater Size: 285*375mm
Temperature Sensor: 1 pcs
Operation Method: 7″ HD touch screen
Control System: Autonomous heating control system V2（software copyright）
Display System: 15″ SD industrial display (720P front screen)
Alignment System: 2 Million Pixel SD digital imaging system, automatic optical zoom with laser: red-dot indicator
Vacuum Adsorption: Automatic
Alignment Accuracy: ±0.02mm
Temperature Control: K-type thermocouple closed-loop control with accuracy up to ±3℃
Feeding Device: No
Positioning: V-groove with universal fixture
Post time: Dec-09-2022