What Is The Features of BGA Rework Station?
A BGA rework station is a piece of equipment used to rework and rework integrated circuits (ICs) in BGA packages. BGA packages are widely used in modern electronics, but due to a number of factors (e.g., soldering defects, overheating, etc.), these components sometimes need to be repaired or replaced. The BGA rework station is able to provide the appropriate heating, cooling, and positioning features to ensure the success of the process.
NeoDen BGA rework station Applications
Electronic Manufacturing Services: Repairing and reworking substandard boards to improve product yields. Repair centers: to provide repair services for electronic devices for consumers or businesses, especially for high-end electronics (e.g., cell phones, computers, etc.). R&D lab: for rapid prototyping and small production line, repairing packaged ICs in test samples.
BGA Rework Station
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NeoDen ND722R BGA Rework Station
Specification
MOQ: 1 Set
PCB Size: 412*370mm (Max); 6*6mm (Min)
BGA Chip Size: 60*60mm (Max); 2*2mm (Min)
IR Heater Size: 285*375mm
Dimensions: L685*W633*H850mm
